Die Aussteller zur MSE 2016: Hysitron - The World Leader in Nanomechanical Test Instruments

TI 980 TriboIndenter: The next-generation nanomechanical test instrument providing industry-leading sensitivity and unprecedented performance.

PI 88 SEM PicoIndenter: Depth-sensing nanomechanical test instruments that can be interfaced with scanning electron microscopes (SEM).

Delivering the World´s Most Innovative Nanomechanical Testing Solution to Accelerate the Development of Tomorrow´s Materials

Standalone Instruments

Industry-Leading Quantitative Mechanical & Tribological Characterization at the Nanoscale and Microscale

Hysitron’s standalone nanomechanical test instruments deliver the highest degree of performance, accuracy, reliability, and versatility for quantitative mechanical and tribological characterization at the nanoscale and microscale. Utilizing multiple patented and proprietary technologies, Hysitron’s standalone nanomechanical test instruments enable quantitative characterization at length scales unreachable by others. Combined with a comprehensive suite of hybrid characterization techniques, the TI 980 TriboIndenter® will keep your materials development at the forefront of technology.


Instruments for Microscopes
Quantitative Nanomechanics Enhanced with the Power of Microscopy

Hysitron has developed a comprehensive suite of nanomechanical and nanotribological test instruments that operate in conjunction with powerful microscopy techniques. Combining the advantages of advanced microscopy technologies with quantitative in-situ nanomechanical characterization enables an accelerated understanding of material behavior at the nanoscale.

Techniques & Properties
Delivering a Comprehensive Understanding of Material Behavior at the Nano/Micro scale

Hysitron has developed a diverse product portfolio to characterize material properties, tribological properties, and interfacial properties of materials at the nanometer and micrometer length scale. 

  • Mechanical Properties
    Quantitative Characterization of Elastic Modulus, Hardness, Viscoelastic, Creep, Stress Relaxation, Interfacial, and Fracture Properties at the Nanoscale and Microscale
  • Hybrid Imaging Techniques
    Enhanced Understanding of Nanomechanical and Nanotribologal Properties through in-situ SEM, TEM, SPM, Raman, and Fluorescence Microscopy 
  • Environmental Characterization
    Quantitative Mechanical and Tribological Characterization in Non-Ambient Environments at the Nanoscale and Microscale
  • Electro-Mechanical Properties
    Hybrid Nanomechanical and Electrical Characterization
  • Tribology
    Quantitative Nanoscale to Microscale Friction and Wear Characterization

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